8 Technology Platforms
Indium Phosphide PICs
Enables design, prototyping, and packaging of InP‑based photonic integrated circuits with integrated lasers, modulators, and detectors for high‑speed optical applications.
Step by step
From design to reliability testing
Design
Guidance in designing active InP-based PICs with lasers, modulators and detectors fully integrated on-chip.
Prototyping
Fabricate high-performance InP chips through advanced epitaxy, processing and packaging services.
Measurement
Comprehensive optical, electrical and RF testing to assess laser performance, modulation speed and insertion losses.
Proof-of-concept
Validate new applications such as high-speed data links, sensing or quantum devices with functional prototypes.
Reliability testing
Test long-term stability of active components under thermal and electrical stress.
